It is used as fluorine source for high energy chemical laser of hydrogen fluoride and fluoride . gas. It is an excellent plasma etching gas in the microelectronics industry. It is the class 2.2 toxic gas, and its maximum allowable content in the air is 29mg/m3.
In 2021, Establish R&D and Operation Center, Further integrate high-quality material resources at home and abroad and then provide more valuable services to customers.
